Semiconductor device and method of forming microelectromechanical systems (MEMS) package

A method of making a semiconductor device, comprising:

• providing a first semiconductor die;
• forming a build-up interconnect structure over the first semiconductor die;
• forming a warpage balance layer over the first semiconductor die opposite the build-up interconnect structure;
• and
• disposing a second semiconductor die over the first semiconductor die, wherein the first semiconductor die or second semiconductor die includes a microelectromechanical system (MEMS).

A semiconductor device, comprising:

• a first semiconductor die;
• a modular interconnect structure disposed adjacent to the first semiconductor die;
• a first encapsulant deposited over the first semiconductor die and modular interconnect structure;
• a build-up interconnect structure formed over the first semiconductor die, modular interconnect structure, and first encapsulant;
• a second semiconductor die including a microelectromechanical system (MEMS) disposed over the first semiconductor die opposite the build-up interconnect structure;
• a lid disposed over the second semiconductor die;
• and
• a second encapsulant deposited over the second semiconductor die and lid.

A semiconductor device, comprising:

• a first semiconductor die;
• a build-up interconnect structure formed over the first semiconductor die;
• a warpage balance layer disposed over the first semiconductor die opposite the build-up interconnect structure;
• and
• a second semiconductor die disposed over the first semiconductor die, wherein the first semiconductor die or second semiconductor die includes a microelectromechanical system (MEMS).