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OwnerDavid METZ, Yanko SAROV +2inventors
InventorsDavid METZ, Yanko SAROV, Fabian HAACKER, Johannes EISENMENGER
Estimating the term…
In a method of post-processing MEMS chips comprising MEMS structures arranged on a carrier material and having at least one projection region of projecting material protruding laterally beyond the region of the MEMS chip provided with MEMS structures, at least one projection region is removed by separating the projecting material from the carrier material of the MEMS chip. For handling MEMS chips without regions projecting beyond the MEMS structures arranged on a carrier material, for example after post-processing according to the disclosure has been carried out, at least one lateral depression is provided in the carrier material and the MEMS chips are handled by way of a tool engaging in the lateral depression(s).
A method of post-processing of MEMS chips comprising MEMS structures, a carrier material supported by the MEMs structures and a projection region protruding laterally beyond a region defined with MEMS structures, the projection region comprising a projection material, the method comprising:
The method as claimed in any of the preceding claims, characterized in that
A method for handling of MEMS chips comprising MEMs structures and a carrier supporting the MEMs structures, the MEMS chips being devoid of regions projecting beyond the MEMS structures, the method comprising:
Dependencies are inferred from the claim text.