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US 2024/0355677 A1Published application
Method for manufacturing electronic device and electronic device
AssigneeTDK Corporation
InventorsShinji HARA, Susumu AOKI, Kazuya MAEKAWA, Maiko KOKUBO, Takahiro NAKAGAWA
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Abstract
A method for manufacturing an electronic device includes a stretchable member attachment step of attaching stretchable member 21 to first substrate 2 on which second substrate 3 is stacked, a first modification line formation step of forming one or more first modification lines 22 by irradiating the first substrate 2 with a laser beam, and a dividing step of stretching the stretchable member 21 to divide the first substrate 2 along the one or more first modification lines 22.
Claims14
A method for manufacturing an electronic device comprising:
- a stretchable member attachment step of attaching a stretchable member to a first substrate on which a second substrate is stacked;
- a first modification line formation step of forming at least one first modification line by irradiating the first substrate with a laser beam;
- and
- a dividing step of stretching the stretchable member to divide the first substrate along the at least one first modification line.
1 more element
An electronic device comprising:
- a first substrate;
- and
- a second substrate stacked with the first substrate, wherein:
- in a plan view from a direction in which the first substrate and the second substrate are stacked, the first substrate has a first projecting portion that projects from the second substrate in a first direction, and the second substrate has a second projecting portion that projects from the first substrate in a direction opposite to the first direction;
- and
- at least one of a surface of the first projecting portion that faces the second substrate and a surface of the second projecting portion that faces the first substrate has a pad region.
3 more elements
Dependencies are inferred from the claim text.