Micromachined transducers and method of fabrication
AssigneeAvago Technologies Wireless IP (Singapore) Pte. Ltd.
InventorsDavid Martin, Joel Philliber
Life of this patent
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Abstract
In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
Claims18
A method of fabricating a transducer, the method comprising:
- providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness;
- patterning a mask over a second surface, wherein the mask comprises an opening for forming a scribe etch;
- and
- etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
A method of fabricating transducers, the method comprising:
- providing a plurality of transducers spaced apart over a first surface of a wafer substrate, the wafer substrate having a corresponding thickness;
- patterning a mask over a second surface of the wafer substrate opposite the first surface, wherein the mask comprises a plurality of first openings located opposite the plurality of transducers, respectively, and at least one second opening located between adjacent first openings of the plurality of first openings;
- and
- etching substantially simultaneously through the second surface a plurality of cavities corresponding to the plurality of first openings and at least one scribe etch corresponding to the at least one second opening, wherein each of the plurality of cavities extends through the thickness of the wafer substrate and the at least one scribe etch extends through a portion of the thickness of the substrate, less than the thickness of the substrate.
A method of fabricating transducers, the method comprising:
- providing a plurality of transducers spaced apart over a first surface of a wafer substrate, the wafer substrate having a corresponding thickness;
- patterning a mask over a second surface of the wafer substrate opposite the first surface, wherein the mask comprises a plurality of first openings located opposite the plurality of transducers, respectively, and at least one second opening located between adjacent first openings of the plurality of first openings;
- etching substantially simultaneously a plurality of cavities corresponding to the plurality of first openings and at least one scribe etch corresponding to the at least one second opening, wherein each of the plurality of cavities extends through the thickness of the wafer substrate and the at least one scribe etch extends through a portion of the thickness of the substrate, less than the thickness of the substrate;
- forming a scribe line on the first surface of the wafer substrate opposite each of the at least one scribe etch;
- and
- applying a bending force across the scribe line to separate adjacent transducers of the plurality of transducers from one another.
Dependencies are inferred from the claim text.