Sensor device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChieh-An YEH, Tai-Hung KUO
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Abstract
A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.
Claims20
A method of manufacturing an electronic package, comprising:
- providing an electronic packaging structure comprising a carrier and an electronic component carried by the carrier, wherein the electronic component has a first surface and a hole exposed from the first surface;
- covering the hole to space apart the hole from a space outside of the electronic packaging structure;
- sawing the electronic packaging structure;
- and
- exposing the hole to the space outside of the electronic packaging structure.
A method of manufacturing an electronic package, comprising:
- providing a platform and a tape, wherein the tape has a first surface attached to the platform and a second surface opposite to the first surface;
- adhering the second surface of the tape to an electronic packaging structure;
- and
- removing a first adhesion of the first surface and a second adhesion of the second surface.
A method of manufacturing a device package, comprising:
- providing an encapsulated packaging structure including:
- an electronic component having an active surface and a hole exposed by the active surface;
- and
- an encapsulation layer encapsulating the electronic component, wherein the hole is exposed by the encapsulation layer;
- attaching a film to the encapsulated packaging structure until the film horizontally overlaps the hole;
- and
- dividing the encapsulated packaging structure into a plurality of unit device packages.
Dependencies are inferred from the claim text.