B81C 1/0088
Separation allowing recovery of the substrate or a part of the substrate
Official title: {Separation allowing recovery of the substrate or a part of the substrate, e.g. epitaxial lift-off}
B81C1/0088 (Separation allowing recovery of the substrate or a part of the substrate) appears on 15 US grants and 19 published applications in this corpus.
Search patents in B81C- Granted patents
- 15
- Published applications
- 19
- Assignees
- 11
- Inventors
- 30
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 2 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 2 | 1 |
| 2016 | 0 | 2 |
| 2017 | 2 | 0 |
| 2018 | 1 | 1 |
| 2019 | 2 | 2 |
| 2020 | 1 | 1 |
| 2021 | 0 | 1 |
| 2022 | 2 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor devices and related methods23 Sep 2025US 12,421,105 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor devices and related methods12 Jul 2022US 11,383,970 B2Amkor Technology Singapore Holding Pte.Ltd.
- Sample well fabrication techniques and structures for integrated sensor devices3 May 2022US 11,322,413 B2Quantum-Si Incorporated
- Method for producing thin MEMS chips on SOI substrate and micromechanical component10 Mar 2020US 10,584,029 B2Robert Bosch GmbH
- Method for manufacturing gas detector by MEMS process21 May 2019US 10,294,100 B2Taiwan Carbon Nano Technology Corporation
- Sample well fabrication techniques and structures for integrated sensor devices15 Jan 2026US 2026/0020323 A1Quantum-Si Incorporated
- Semiconductor devices and related methods23 Oct 2025US 2025/0326632 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor devices and related methods5 Jan 2023US 2023/0002217 A1Amkor Technology Singapore Holding Pte.Ltd.
- Sample well fabrication techniques and structures for integrated sensor devices28 Jul 2022US 2022/0238389 A1Quantum-Si Incorporated
- Semiconductor devices and related methods14 Jan 2021US 2021/0009406 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Systems and methods for laser splitting and device layer transfer16US 9,214,353 B2Solexel, Inc. · 2015
- Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support13US 6,696,364 B2STMicroelectronics S,r.l. · 2004
- Systems and methods for laser splitting and device layer transfer8US 9,929,054 B22018
- Method for using DRIE with reduced lateral etching3US 6,752,931 B2Texas Instruments Incorporated · 2004
- Wafer processing method2US 8,815,644 B2Disco Corporation · 2014