Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support
AssigneeSTMicroelectronics S.r.l.
InventorsIlaria Gelmi, Simone Sassolini, Stefano Pozzi, Massimo Garavaglia
Life of this patent
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Abstract
A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.
Claims18
A method for processing MEMS devices integrated on a semiconductor wafer comprising:
- bonding the semiconductor wafer comprising the MEMS devices onto a support;
- dicing the semiconductor wafer into a plurality of independent MEMS devices on the support;
- and
- processing the independent MEMS devices on the support in a treatment environment for semiconductor wafers.
A method for making MEMS devices comprising:
- forming a plurality of MEMS devices integrated on a semiconductor substrate;
- bonding the semiconductor wafer comprising the MEMS devices onto a support using an anhydrous HF-resistant glue;
- dicing the semiconductor wafer into a plurality of independent MEMS devices on the support;
- and
- processing the independent MEMS devices on the support in an anhydrous HF solution.
Dependencies are inferred from the claim text.