B81C 1/00873
Characterised by special arrangements of the devices, allowing an easier separation
Official title: {characterised by special arrangements of the devices, allowing an easier separation}
B81C1/00873 (Characterised by special arrangements of the devices, allowing an easier separation) appears on 73 US grants and 74 published applications in this corpus.
Search patents in B81C- Granted patents
- 73
- Published applications
- 74
- Assignees
- 53
- Inventors
- 148
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 1 |
| 2003 | 4 | 4 |
| 2004 | 2 | 1 |
| 2005 | 1 | 3 |
| 2006 | 4 | 7 |
| 2007 | 1 | 4 |
| 2008 | 4 | 5 |
| 2009 | 5 | 7 |
| 2010 | 4 | 5 |
| 2011 | 8 | 2 |
| 2012 | 2 | 3 |
| 2013 | 0 | 3 |
| 2014 | 6 | 5 |
| 2015 | 3 | 4 |
| 2016 | 5 | 4 |
| 2017 | 5 | 2 |
| 2018 | 2 | 5 |
| 2019 | 3 | 2 |
| 2020 | 2 | 0 |
| 2021 | 1 | 2 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 1 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Method for producing a plurality of sensor devices, and sensor device14 Jan 2025US 12,195,330 B2Robert Bosch GmbH
- MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing method of liquid ejecting apparatus19 Jul 2022US 11,390,079 B2Seiko Epson Corporation
- Through-substrate conductor support10 Aug 2021US 11,084,717 B2Texas Instruments Incorporated
- Deep trenches on microelectromechanical system wafers for stealth dicing30 Apr 2026US 2026/0116745 A1Lumentum Operations LLC
- Method Of Manufacturing Wheel For Timepiece, Plate-Shaped Member, Wheel For Timepiece, And Timepiece26 Dec 2024US 2024/0427289 A1Seiko Epson Corporation
- Integrated dicing die bonding sheet and method for producing semiconductor device14 Mar 2024US 2024/0087941 A1Dow Toray Co., Ltd.
- Partial dicing process for wafer-level packaging30 Mar 2023US 2023/0100911 A1
- Method for producing a plurality of sensor devices, and sensor device10 Feb 2022US 2022/0041436 A1Robert Bosch GmbH
Most cited
By later US patents
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device111US 7,754,584 B2Panasonic Corporation · 2010
- Wafer level method of capping multiple MEMS elements104US 6,448,109 B1Analog Devices, Inc. · 2002
- Separation of wafer into die with wafer-level processing72US 5,597,767 ATexas Instruments Incorporated · 1997
- Silicon wafer configuration and method for forming same43US 6,521,513 B1Eastman Kodak Company · 2003