Separation of wafer into die with wafer-level processing
AssigneeTexas Instruments Incorporated
InventorsMichael A. Mignardi, Laurinda Ng, Ronald S. Croff, Robert McKenna, Lawrence D. Dyer
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Abstract
A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).
Claims20
A method of separating a wafer into die, comprising the steps of:
- covering the top surface of said wafer with a protective coating;
- inscribing separation lines on said wafer, said separation lines representing boundaries between die;
- removing said protective coating;
- processing said wafer with at least one wafer-level process;
- and
- separating said wafer into die along said separation lines.
A method of separating a wafer, used for manufacturing micromechanical devices, into die, comprising the steps of:
- covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under micro-mechanical elements of said die;
- inscribing separation lines on said wafer, said separation lines representing boundaries between die;
- removing said protective coating;
- removing said sacrificial layer using a wafer-level process;
- and
- separating said wafer into die along said separation lines.
A method of separating a wafer, used for manufacturing digital micro-mirror devices, into die, comprising the steps of:
- covering the top surface of said wafer with a protective coating, said die having at least one sacrificial layer under mirror elements of said die;
- inscribing separation lines on said wafer, said separation lines representing boundaries between die;
- removing said protective coating;
- removing said sacrificial layer using a wafer-level process;
- testing said die by stepping from die-to-die as registered on said wafer;
- and
- separating said wafer into die along said separation lines.
Dependencies are inferred from the claim text.