Through-substrate conductor support
AssigneeTexas Instruments Incorporated
InventorsVirgil Cotoco Ararao, John Charles Ehmke
Life of this patent
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Abstract
In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.
Claims10
A method, comprising:
- attaching first and second circuitry to a first surface of a substrate, the substrate having the first surface and a second surface opposite the first surface;
- electrically coupling the first circuitry to a first segment of a first conductor on the first surface, the first segment having a first elevated portion spaced away from the first surface;
- electrically coupling the second circuitry to a second segment of the first conductor on the first surface, the second segment having a second elevated portion spaced away from the first surface;
- encapsulating the first elevated portion with a first supporting material that supports the first elevated portion;
- encapsulating the second elevated portion with a second supporting material that supports the second elevated portion;
- forming a third segment of a second conductor electrically coupled to the first elevated portion and to a first surface mounting contact structure on the second surface;
- and
- forming a fourth segment of the second conductor electrically coupled to the second elevated portion and to a second surface mounting contact structure on the second surface.
Dependencies are inferred from the claim text.