B81C 1/00888
Multistep processes involving only mechanical separation
Official title: {Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving}
B81C1/00888 (Multistep processes involving only mechanical separation) appears on 80 US grants and 83 published applications in this corpus.
Search patents in B81C- Granted patents
- 80
- Published applications
- 83
- Assignees
- 58
- Inventors
- 199
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 8 |
| 2003 | 3 | 1 |
| 2004 | 7 | 5 |
| 2005 | 4 | 4 |
| 2006 | 3 | 4 |
| 2007 | 3 | 4 |
| 2008 | 3 | 3 |
| 2009 | 1 | 2 |
| 2010 | 4 | 1 |
| 2011 | 1 | 5 |
| 2012 | 2 | 1 |
| 2013 | 1 | 3 |
| 2014 | 1 | 0 |
| 2015 | 1 | 6 |
| 2016 | 5 | 4 |
| 2017 | 5 | 6 |
| 2018 | 3 | 5 |
| 2019 | 5 | 2 |
| 2020 | 2 | 5 |
| 2021 | 4 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 3 |
| 2024 | 1 | 2 |
| 2025 | 4 | 4 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for manufacturing mirror device23 Jun 2026US 12,662,373 B2Hamamatsu Photonics K.K.
- MEMS device2 Sep 2025US 12,404,168 B2Huawei Technologies Co., Ltd.
- Sensor element and method for producing a sensor element3 Jun 2025US 12,320,716 B2TDK Electronics Co., Ltd.
- Sensor element and method for producing a sensor element29 Apr 2025US 12,287,246 B2TDK Electronics Co., Ltd.
- Mems pressure transducer wafer-level chip-scale package and method for producing the same14 May 2026US 2026/0132018 A1Infineon Technologies AG
- Mems devices singulated by plasma etch16 Oct 2025US 2025/0320115 A1
- Actuator layer deposition and transfer2 Oct 2025US 2025/0304434 A1InvenSense, Inc.
- Semiconductor device and method for manufacturing the same11 Sep 2025US 2025/0282610 A1Murata Manufacturing Co., Ltd.
- Bonding process for forming semiconductor device structure12 Jun 2025US 2025/0187907 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and apparatuses for singulation of microelectromechanical systems164US 5,923,995 ANational Semiconductor Corporation · 1999
- Semiconductor substrate117US 7,859,084 B2Panasonic Corporation · 2010
- Method for separating circuit dies from a wafer112US 5,362,681 AAnaglog Devices, Inc. · 1994
- Method for manufacturing a semiconductor device86US 5,824,177 ANippondenso Co., Ltd. · 1998
- Method and device for protecting micro electromechanical system structures during dicing of a wafer73US 6,555,417 B2Analog Devices, Inc. · 2003