Semiconductor substrate
AssigneePanasonic Corporation
InventorsMasaki Utsumi, Takahiro Kumakawa
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Abstract
A semiconductor substrate (1) includes a plurality of semiconductor elements (2) in which functional elements are constructed and which is formed in a grid pattern, wherein continuous linear grooves (3) are formed on longitudinal and lateral separating lines (4) that individually separate the plurality of semiconductor elements (2) with the exception of intersections of the separating lines (4) and portions corresponding to corners of each semiconductor element (2).
Claims3
A semiconductor substrate on which a plurality of semiconductor elements each containing functional elements are located in a grid pattern, having a diaphragm structure provided with a depression on a rear face-side of each semiconductor element, with linear grooves in the semiconductor substrate extending along longitudinal and lateral lines individually separating the plurality of semiconductor elements with the exception of intersections of the separating lines.
Dependencies are inferred from the claim text.