Method for separating circuit dies from a wafer
AssigneeAnaglog Devices, Inc.
InventorsCarl M. Roberts, Jr., Lewis H. Long, Paul A. Ruggerio
Life of this patent
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Abstract
A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.
Claims13
A method of separating an individual microcircuit die from a wafer comprising a plurality of dies containing componentry on a first side thereof, including at least a first component, said wafer comprising at least one street separating said dies from each other, said method comprising the steps of:
- (1) placing clearance holes in a protective film, said clearance holes having a size corresponding to said first component,
- (2) fixing said first side of said wafer to a first side of a protective film such that said clearance holes in said protective film align with said first component,
- (3) sawing said wafer along said at least one street whereby at least one of said dies is detached from all of the other dies on said wafer, and
- (4) removing said at least one detached die from said protective film.
Dependencies are inferred from the claim text.