Method and device for protecting micro electromechanical system structures during dicing of a wafer
AssigneeAnalog Devices, Inc.
InventorsTimothy R. Spooner, Kieran P. Harney
Life of this patent
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Abstract
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
Claims20
A method for protecting a MEMS structure during a dicing of a MEMS wafer to produce individual MEMS dies, comprising the steps of:
- (a) preparing a MEMS wafer having a plurality of MEMS structure sites thereon;
- (b) mounting, upon the MEMS wafer, punched tape, the punched tape having holes in areas corresponding to locations of the MEMS structure sites on the MEMS wafer;
- (c) mounting, upon the punched tape, a cover tape to produce a laminated MEMS wafer, the cover tape being without openings;
- and
- (d) dicing the laminated MEMS wafer into a plurality of MEMS dies.
Dependencies are inferred from the claim text.