B81C 1/00896
Temporary protection during separation into individual elements
Official title: {Temporary protection during separation into individual elements}
B81C1/00896 (Temporary protection during separation into individual elements) appears on 116 US grants and 118 published applications in this corpus.
Search patents in B81C- Granted patents
- 116
- Published applications
- 118
- Assignees
- 66
- Inventors
- 246
- Latest grant
- 13 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 4 |
| 2002 | 10 | 12 |
| 2003 | 5 | 4 |
| 2004 | 7 | 8 |
| 2005 | 9 | 21 |
| 2006 | 7 | 7 |
| 2007 | 7 | 9 |
| 2008 | 6 | 4 |
| 2009 | 4 | 2 |
| 2010 | 7 | 4 |
| 2011 | 3 | 3 |
| 2012 | 3 | 3 |
| 2013 | 3 | 3 |
| 2014 | 3 | 2 |
| 2015 | 5 | 6 |
| 2016 | 4 | 2 |
| 2017 | 2 | 3 |
| 2018 | 6 | 6 |
| 2019 | 3 | 5 |
| 2020 | 3 | 3 |
| 2021 | 2 | 2 |
| 2022 | 2 | 3 |
| 2023 | 3 | 0 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method with mechanical dicing process for producing MEMS components13 Aug 2024US 12,060,266 B2Infineon Technologies AG
- MEMS tab removal process20 Feb 2024US 11,905,170 B2InvenSense, Inc.
- Encapsulant barrier7 Nov 2023US 11,807,522 B2Texas Instruments Incorporated
- Protective member forming apparatus24 Oct 2023US 11,794,384 B2Disco Corporation
- Actuator, optical scanning device, and manufacturing methods25 Apr 2023US 11,635,615 B2Mitsumi Electric Co., Ltd.
- Method for singulating a wafer and suitable device21 May 2026US 2026/0138869 A1Carl Zeiss SMT GmbH
- Structure and method for bonded wafer barrier22 Aug 2024US 2024/0282716 A1Texas Instruments Incorporated
- Method of Manufacturing and Passivating a Die10 Nov 2022US 2022/0359258 A1
- Mems tab removal process16 Jun 2022US 2022/0185662 A1InvenSense, Inc.
- Protective member forming apparatus27 Jan 2022US 2022/0024085 A1Disco Corporation
Most cited
By later US patents
- Protection of microelectronic devices during packaging182US 6,335,224 B12002
- Methods and apparatuses for singulation of microelectromechanical systems164US 5,923,995 ANational Semiconductor Corporation · 1999
- Pre-release plastic packaging of MEMS and IMEMS devices124US 6,379,988 B1Sandia Corporation · 2002
- Method for fabricating semiconductor device112US 7,838,323 B2Panasonic Corporation · 2010
- Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates101US 6,969,635 B2Reflectivity, INC · 2005