Structure and method for bonded wafer barrier
AssigneeTexas Instruments Incorporated
InventorsJohn C. Ehmke, Jennifer Lynne Holm
Life of this patent
Estimating the term…
Abstract
An example apparatus includes a semiconductor device layer including a bond pad area, a bond pad on the semiconductor device layer in the bond pad area; a scribe seal on the semiconductor device layer, the scribe seal surrounding the bond pad on at least three sides; and a swarf barrier on the scribe seal, the swarf barrier including: a first portion a first distance from the semiconductor device layer; and a second portion a second distance from the semiconductor device layer, the second distance being larger than the first distance.
Claims18
An apparatus comprising:
- a semiconductor device layer including a bond pad area, a bond pad on the semiconductor device layer in the bond pad area;
- a scribe seal on the semiconductor device layer, the scribe seal surrounding the bond pad on at least three sides;
- and
- a swarf barrier on the scribe seal, the swarf barrier including:
- a first portion a first distance from the semiconductor device layer;
- and
- a second portion a second distance from the semiconductor device layer, the second distance being larger than the first distance.
A microelectromechanical system (MEMS) device comprising:
- a glass layer;
- an interposer layer in contact with the glass layer;
- a bond ring;
- an integrated circuit (IC) layer coupled to the interposer layer by the bond ring, the IC layer including a first area and a second area, the glass layer, and the interposer layer over the IC layer;
- and
- a swarf barrier on the second area of the IC layer, the swarf barrier having a flat portion and a curved portion.
An apparatus comprising:
- a first layer;
- a bond pad on the first layer;
- a second layer;
- a bond ring coupling the first layer and the second layer, a cavity between the first layer and the second layer at least partially surrounded by the bond ring, the bond pad outside the cavity;
- a scribe seal on the first layer;
- and
- a swarf barrier on the scribe seal, the swarf barrier surrounding the bond pad on at least three sides.
Dependencies are inferred from the claim text.