Method with mechanical dicing process for producing MEMS components

A method for producing micro-electromechanical system (MEMS) components, comprising:

• forming a carrier having a plurality of recesses;
• arranging an adhesive structure on the carrier and in the plurality of recesses;
• forming a semiconductor wafer having a plurality of MEMS structures arranged near a first main surface of the semiconductor wafer;
• attaching the adhesive structure to the first main surface of the semiconductor wafer, with the plurality of recesses being arranged above the plurality of MEMS structures and the adhesive structure not contacting the plurality of MEMS structures;
• singulation of the semiconductor wafer into a plurality of MEMS components by applying a mechanical dicing process such that the semiconductor wafer has a singulated arrangement corresponding to the plurality of MEMS components;
• after the singulation of the semiconductor wafer, arranging a second main surface of the semiconductor wafer having the singulated arrangement on a tape-and-frame carrier such that the plurality of MEMS components are arranged on the tape-and-frame carrier, wherein the second main surface is located opposite to the first main surface;
• after arranging the second main surface of the semiconductor wafer having the singulated arrangement on the tape-and-frame carrier, removing the carrier and the adhesive structure from the plurality of MEMS components using one or more of a heat treatment or a UV treatment of the adhesive structure;
• and
• after removing the carrier and the adhesive structure from the plurality of MEMS components:
• arranging the tape-and-frame carrier with the plurality of MEMS components on a wafer chuck;
• arranging an edge of the tape-and-frame carrier on a pretension chuck, wherein the pretension chuck is configured to lift the edge of the tape-and-frame carrier relative to an inner region of the tape-and-frame carrier that is coupled to the wafer chuck;
• and
• separating an edge region of the semiconductor wafer from the semiconductor wafer such that the edge region of the semiconductor wafer is detached from the tape-and-frame carrier.