Method of Manufacturing and Passivating a Die
OwnerMehrdad Shayganpoor, Guenter Aflenzerinventors
Life of this patent
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Abstract
In an embodiment, a method for manufacturing and passivating a die includes providing the die having an active frontside including a protrusion, the protrusion configured for electrically contacting the die, covering a portion of the protrusion by a passivation tape before applying a passivation layer, applying the passivation layer on all sides of the die including the frontside and its protrusion in one single process, except on the portion covered by the passivation tape and detaching the passivation tape from the covered portion of the protrusion after applying the passivation layer to expose the portion of the protrusion which forms an electrical contact area.
Claims21
-21. (canceled)
A method for manufacturing and passivating a die, the method comprising:
- providing the die comprising an active frontside having a protrusion, the protrusion configured for electrically contacting the die;
- covering a portion of the protrusion by a passivation tape before applying a passivation layer;
- applying the passivation layer on all sides of the die including the frontside and its protrusion in one single process, except on the portion covered by the passivation tape;
- and
- detaching the passivation tape from the covered portion of the protrusion after applying the passivation layer to expose the portion of the protrusion which forms an electrical contact area.
A wafer level packaging method comprising:
- providing a wafer comprising an active frontside with several protrusions, which are configured for electrically contacting a die, and a passive backside;
- singulating the wafer into single dies, each with at least one protrusion;
- covering a portion of each protrusion by a passivation tape before applying a passivation layer;
- applying the passivation layer on all sides, including the frontside, the backside and all lateral sides of the singulated dies in one single process, except on the portions covered by the passivation tape;
- and
- detaching the passivation tape from the covered portions of the protrusions after applying the passivation layer to expose the portions of the protrusions which form electrical contact areas.
The method of claim 3o, wherein the second adhesive layer on the grinding tape is thicker than a first adhesive layer on the passivation tape.
The method of claim 3o, wherein a distance between two adjacent dies while applying the passivation layer is kept equal to a width of a dicing street formed by partially dicing.
The method of claim 30, further comprising applying a protective layer on the frontside of the wafer before partially dicing.
The method of claim 30, wherein the backside is covered with a dicing tape while partially dicing the wafer into the dies from the frontside.
A die comprising:
- a passivation layer covering all sides and edges of the die except an electrical contact area on a protrusion,
- wherein the passivation layer is uniform, continuous and homogeneous on every side.
Dependencies are inferred from the claim text.