B81B 2207/091
Arrangements for connecting external electrical signals to mechanical structures inside the package
B81B2207/091 (Arrangements for connecting external electrical signals to mechanical structures inside the package) appears on 909 US grants and 1,077 published applications in this corpus.
Search patents in B81B- Granted patents
- 909
- Published applications
- 1,077
- Assignees
- 311
- Inventors
- 1,700
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 6 | 11 |
| 2003 | 4 | 4 |
| 2004 | 9 | 17 |
| 2005 | 13 | 24 |
| 2006 | 9 | 20 |
| 2007 | 8 | 28 |
| 2008 | 12 | 35 |
| 2009 | 18 | 20 |
| 2010 | 24 | 44 |
| 2011 | 30 | 51 |
| 2012 | 42 | 49 |
| 2013 | 47 | 66 |
| 2014 | 65 | 67 |
| 2015 | 83 | 67 |
| 2016 | 63 | 72 |
| 2017 | 79 | 64 |
| 2018 | 50 | 69 |
| 2019 | 65 | 58 |
| 2020 | 68 | 73 |
| 2021 | 45 | 51 |
| 2022 | 46 | 30 |
| 2023 | 31 | 40 |
| 2024 | 28 | 40 |
| 2025 | 23 | 47 |
| 2026 | 29 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 2207/094Feed-through, viaIndexing code548
- B81B 2207/092Buried interconnects in the substrate or in the lidIndexing code160
- B81B 2207/097Interconnects arranged on the substrate or the lid, and covered by theIndexing code154
- B81B 2207/098Arrangements not provided for in groups b81b2207/092 - b81b2207/097Indexing code122
- B81B 2207/093Conductive package sealIndexing code62
Recent patents
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- PMUT array with resonance frequency tunable due to adjustable embedded cavity1 Sep 2026US 12,724,146 B2STMicroelectronics International N. V.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
Most cited
By later US patents
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Vacuum package fabrication of microelectromechanical system devices with integrated circuit components166US 6,479,320 B1Raytheon Company · 2002
- Method for manufacturing a semiconductor acceleration sensor device157US 5,668,033 ANippondenso Co., Ltd. · 1997