B81B 2207/092
Buried interconnects in the substrate or in the lid
B81B2207/092 (Buried interconnects in the substrate or in the lid) appears on 160 US grants and 163 published applications in this corpus.
Search patents in B81B- Granted patents
- 160
- Published applications
- 163
- Assignees
- 80
- Inventors
- 327
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 2 |
| 2005 | 2 | 5 |
| 2006 | 4 | 2 |
| 2007 | 0 | 3 |
| 2008 | 2 | 5 |
| 2009 | 2 | 2 |
| 2010 | 3 | 11 |
| 2011 | 5 | 8 |
| 2012 | 9 | 10 |
| 2013 | 10 | 10 |
| 2014 | 19 | 11 |
| 2015 | 21 | 10 |
| 2016 | 8 | 9 |
| 2017 | 11 | 12 |
| 2018 | 10 | 9 |
| 2019 | 13 | 8 |
| 2020 | 10 | 14 |
| 2021 | 7 | 8 |
| 2022 | 5 | 3 |
| 2023 | 7 | 3 |
| 2024 | 4 | 9 |
| 2025 | 3 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- PMUT array with resonance frequency tunable due to adjustable embedded cavity1 Sep 2026US 12,724,146 B2STMicroelectronics International N. V.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Wafer level integration of transducer elements, techniques and implementations2 Sep 2025US 12,406,963 B2Elta Systems Ltd.
- Semiconductor device and method of forming microelectromechanical systems (MEMS) package3 Jun 2025US 12,319,564 B2STATS ChipPAC Pte. Ltd.
- Bypass structure13 May 2025US 12,297,097 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- MEMS Sensor Module9 Apr 2026US 2026/0097955 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Method for Fabricating a Hermetically Sealed Contact and Hermetically Sealed Contact14 Aug 2025US 2025/0256956 A1Albert-Ludwigs-Universität Freiburg
- Bypass structure31 Jul 2025US 2025/0243051 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Method of manufacturing a microphone95US 7,434,305 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method91US 7,381,589 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method89US 8,018,049 B2Knowles Electronics, LLC · 2011