Wafer level integration of transducer elements, techniques and implementations

A method of constructing an integrated circuit assembly, the method comprising:

• providing an interposer board, a plurality of interfacing dies, an intermediating board and a panel of active elements comprising a plurality of active elements;
• electrically coupling a-said plurality of interfacing dies to an interposer wafer to provide a base wafer of said integrated circuit assembly, said interposer wafer configured to provide connectivity to said plurality of interfacing dies;
• electrically coupling said active element wafer to an intermediating wafer to thereby-provide a cap wafer of said integrated circuit assembly, said intermediating wafer configured to provide connectivity to said plurality of active elements;
• and
• attaching said cap wafer to said base wafer to position said panel of active elements at a top side of said integrated circuit such that each one of said plurality of active elements is electrically coupled to at least one of said plurality of interfacing dies.