B81B 2207/098
Arrangements not provided for in groups b81b2207/092 - b81b2207/097
Official title: Arrangements not provided for in groups B81B2207/092 - B81B2207/097
B81B2207/098 (Arrangements not provided for in groups b81b2207/092 - b81b2207/097) appears on 122 US grants and 145 published applications in this corpus.
Search patents in B81B- Granted patents
- 122
- Published applications
- 145
- Assignees
- 56
- Inventors
- 247
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 4 |
| 2009 | 1 | 2 |
| 2010 | 2 | 6 |
| 2011 | 0 | 7 |
| 2012 | 2 | 3 |
| 2013 | 8 | 5 |
| 2014 | 6 | 7 |
| 2015 | 10 | 8 |
| 2016 | 8 | 7 |
| 2017 | 6 | 9 |
| 2018 | 4 | 6 |
| 2019 | 9 | 9 |
| 2020 | 12 | 21 |
| 2021 | 10 | 19 |
| 2022 | 15 | 10 |
| 2023 | 8 | 5 |
| 2024 | 7 | 3 |
| 2025 | 8 | 7 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Bottom package exposed die MEMS pressure sensor integrated circuit package design3 Feb 2026US 12,543,575 B2STMicroelectronics S.r.l.
- Integrated circuit package with warpage control using cavity formed in laminated substrate below the integrated circuit die9 Dec 2025US 12,494,419 B2STMicroelectronics (Malta) Ltd
- Electrical contact array for harvesting power from a power circuit18 Nov 2025US 12,476,181 B2University of Louisville Research Foundation, Inc.
- Semiconductor device with embedded battery and method therefor2 Sep 2025US 12,406,911 B2NXP USA, Inc.
- Self-configuring contact arrays for interfacing with electric circuits and fabric carriers19 Feb 2026US 2026/0053035 A1University of Louisville Research Foundation, Inc.
- Bottom package exposed die mems pressure sensor integrated circuit package design6 Nov 2025US 2025/0343119 A1STMicroelectronics S.r.l.
- Semiconductor device mounted on a system board16 Oct 2025US 2025/0321414 A1Texas Instruments Incorporated
- Semiconductor package with metal column mold barrier18 Sep 2025US 2025/0289711 A1
- Integrated ultrasonic transducers28 Aug 2025US 2025/0268575 A1Exo Imaging, Inc.
Most cited
By later US patents
- Method for manufacturing an electronic component package and electronic component package42US 8,846,521 B2Kabushiki Kaisha Toshiba · 2014
- Flip-chip assembly of protected micromechanical devices33US 6,656,768 B2Texas Instruments Incorporated · 2003
- Internal electrical contact for enclosed MEMS devices30US 8,564,076 B1InvenSense, Inc. · 2013
- Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads23US 8,367,522 B1mCube Inc. · 2013
- Semiconductor device and method of forming microelectromechanical systems (MEMS) package21US 9,527,723 B2STATS ChipPAC Pte. Ltd. · 2016