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US 12,406,911 B2Granted
Semiconductor device with embedded battery and method therefor
AssigneeNXP USA, Inc.
InventorsStephen Ryan Hooper, Chanon Suwankasab, Chayathorn Saklang, Crispulo Estira Lictao, Jr., Amornthep Saiyajitara, Dominic (Pohmeng) Koey
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Abstract
A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.
Claims6
A packaged semiconductor device comprising:
- a sensor system affixed to a die pad portion of a leadframe;
- an embedded battery affixed to the leadframe such that a first terminal of the embedded battery is affixed to a first leg of the leadframe and a second terminal of the embedded battery affixed to a second leg of the leadframe;
- and
- an encapsulant wholly encapsulating the sensor system, the embedded battery, and the leadframe such that no portion of the sensor system, the embedded battery, or the leadframe extends outside of the encapsulant.
1 more element
Dependencies are inferred from the claim text.