B81B 2207/093
Conductive package seal
B81B2207/093 (Conductive package seal) appears on 62 US grants and 84 published applications in this corpus.
Search patents in B81B- Granted patents
- 62
- Published applications
- 84
- Assignees
- 48
- Inventors
- 167
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 1 |
| 2008 | 0 | 5 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 6 | 5 |
| 2012 | 4 | 2 |
| 2013 | 2 | 3 |
| 2014 | 2 | 10 |
| 2015 | 5 | 3 |
| 2016 | 6 | 5 |
| 2017 | 4 | 5 |
| 2018 | 1 | 2 |
| 2019 | 3 | 3 |
| 2020 | 5 | 3 |
| 2021 | 1 | 5 |
| 2022 | 2 | 1 |
| 2023 | 3 | 12 |
| 2024 | 1 | 1 |
| 2025 | 7 | 3 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Packaging for a sensor and methods of manufacturing thereof17 Feb 2026US 12,553,752 B2APPLIED Materials.Inc.
- Packaging method and associated packaging structure27 Jan 2026US 12,534,361 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging for a sensor and methods of manufacturing thereof9 Dec 2025US 12,492,926 B2APPLIED Materials.Inc.
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- Packaging for a sensor and methods of manufacturing thereof5 Feb 2026US 2026/0036454 A1APPLIED Materials.Inc.
- Method and system for fabricating a mems device cap11 Dec 2025US 2025/0376371 A1InvenSense, Inc.
- Method and system for fabricating a mems device8 May 2025US 2025/0145456 A1InvenSense, Inc.
- Method and system for fabricating a mems device6 Mar 2025US 2025/0074766 A1InvenSense, Inc.
Most cited
By later US patents
- Method for manufacturing a semiconductor acceleration sensor device157US 5,668,033 ANippondenso Co., Ltd. · 1997
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- MEMS device with integral packaging62US 6,872,902 B2Microassembly Technologies, Inc. · 2005
- Electrical or electronic component encapsulated in a sealed manner25US 6,373,130 B1Societe Francaise de Detecteurs Infrarouges-Sofradir · 2002
- Packages and methods for packaging MEMS microphone devices14US 8,577,063 B2Analog Devices, Inc. · 2013