Packaging for a sensor and methods of manufacturing thereof
AssigneeApplied Materials, Inc.
InventorsArvinder Manmohan Singh Chadha, Ashley M. Okada, Srikanth Krishnamurthy, Ming Xu
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AssigneeApplied Materials, Inc.
InventorsArvinder Manmohan Singh Chadha, Ashley M. Okada, Srikanth Krishnamurthy, Ming Xu
Estimating the term…
Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In certain embodiments, the substrate includes an outer region, an inner region, and a middle region between the outer region and the inner region. In certain embodiments, the substrate includes electrical contact pads on at least the inner region. In certain embodiments, the housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pads. The sensor die is aligned to the substrate via aligning features that align the sensor die relative to the substrate in at least one of a first plane or a second plane.
A sensor assembly comprising:
A gas flow sensor configured to couple to a gas flow tube via a flange, the gas flow sensor comprising:
A method of manufacturing a sensor assembly, the method comprising:
Dependencies are inferred from the claim text.