Microassembly Technologies, Inc.
Richmond, CA, US· latest recorded location
Microassembly Technologies, Inc. is named on 7 US grants and 3 published applications in this corpus. Its most frequent classification is B81C (Processes or apparatus specially adapted for the manufacture or treatment of microstructural).
- Granted patents
- 7
- Published applications
- 3
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 23 Oct 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 2 | 0 |
| 2011 | 0 | 0 |
| 2012 | 2 | 1 |
By publication year.
Technology areas
Share of 10 documents
Recent patents
- MEMS device with integral packaging23 Oct 2012US 8,295,027 B2
- MEMS device with integral packaging15 May 2012US 8,179,215 B2
- Microelectromechanical systems using thermocompression bonding6 Jul 2010US 7,750,462 B1
- High force MEMS device6 Apr 2010US 7,692,521 B1
- Microelectromechanical systems using thermocompression bonding2 Oct 2007US 7,276,789 B1
Most cited
By later US patents
- MEMS device with integral packaging62US 6,872,902 B22005
- Microelectromechanical systems using thermocompression bonding44US 6,853,067 B12005
- Microelectromechanical systems using thermocompression bonding22US 7,750,462 B12010
- High force MEMS device20US 7,692,521 B12010
- Microelectromechanical systems using thermocompression bonding19US 7,276,789 B12007