Microelectromechanical systems using thermocompression bonding

A bonded hybrid structure comprising:

• a first substrate;
• a sensing device disposed on the first substrate and having electrical terminals comprising a plurality of bumps of conductive bonding material;
• a dielectric substrate in aligned confronting relation to the first substrate;
• a plurality of target features of conductive bonding material disposed on the dielectric substrate, at least partially congruent with the bumps of the first substrate;
• the first substrate being thermocompressively bonded to the dielectric substrate to form a hybrid structure such that the plurality of bumps are bonded and electrically coupled to respective ones of the plurality of target features;
• a plurality of conductive lines disposed on the dielectric substrate and extending from the target features bonded to the bumps of the first substrate;
• a second substrate;
• an integrated circuit disposed on the second substrate, and having electrical terminals comprising wire-bond pads;
• and
• the hybrid structure being electrically coupled to the integrated circuit of the second substrate via the wire-bond pads.

An integrated device, comprising:

• a first substrate;
• a microelectromechanical device disposed on the first substrate;
• a first bonding feature comprising conductive bonding material disposed on the first substrate to form a ring;
• a bump of conductive bonding material disposed on the first substrate, the bump being in electrical contact with the device;
• a second substrate substantially aligned in confronting relation to the first substrate;
• a second bonding feature comprising conductive bonding material disposed on the second substrate;
• a target feature made of conductive bonding material disposed on the second substrate;
• and
• a wirebond pad disposed on the second substrate and electrically connected to the target feature, the first substrate and the second substrate being thermocompressively bonded without substantially heating the substrates and with the first bonding feature bonded to the second bonding feature to seal the microelectromechical device in a cavity between the first substrate and the second substrate with an electrical connection between the microelectromechanical device and the target feature and with plastic deformation of at least one of the ring or the second bonding feature.

A wafer-scale thermocompression bonding process for bonding at least first and second wafers together, the first wafer having a microelectromechanical device disposed thereon, the second wafer having an integrated circuit disposed thereon, the bonding process comprising:

• electroplating bonding features including conductive bonding material onto predetermined locations of the first wafer, the bonding features surrounding the micro electromechanical device;
• disposing target features of including conductive bonding material onto complementary locations of the second wafer, the complementary locations at least partially corresponding to the predetermined locations on the first wafer;
• placing the first and second wafers in aligned confronting relation with one another such that the features of the first and second wafers are at least partially congruent;
• and
• applying sufficient pressure and heat to the first and second wafers to plastically deform the features whereby the first and second wafers are thermocompressively bonded together and the integrated circuit and the microelectromechanical device are electrically connected by the bonding.

An apparatus for thermocompressively bonding plural substantially planar substrates together, at least one of the substrates having a prefabricated microelectromechanical device disposed thereon, the substrates also having bonding material disposed thereon and being in aligned confronting relation with one another, the apparatus comprising:

• first and second force transfer means positioned in spaced relation to one another along an axis such that the substrates can be placed into a gap therebetween, at least one of the first and second force transfer means being partially resilient in the direction of the axis;
• means for applying an axially-directed compressive force to the force transfer means to thereby compress the substrates disposed in the gap;
• means for preventing substantially all lateral movement of the force transfer means during application of the axially-directed compressive force;
• and
• means for heating the substrates during application of the axially-directed compressive force to thereby plastically deform the bonding material and thermocompressively bond the substrates together.