B81B 2207/097
Interconnects arranged on the substrate or the lid, and covered by the
Official title: Interconnects arranged on the substrate or the lid, and covered by the package seal
B81B2207/097 (Interconnects arranged on the substrate or the lid, and covered by the) appears on 154 US grants and 180 published applications in this corpus.
Search patents in B81B- Granted patents
- 154
- Published applications
- 180
- Assignees
- 103
- Inventors
- 398
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 5 |
| 2003 | 1 | 1 |
| 2004 | 4 | 5 |
| 2005 | 7 | 5 |
| 2006 | 2 | 2 |
| 2007 | 0 | 5 |
| 2008 | 0 | 5 |
| 2009 | 3 | 6 |
| 2010 | 4 | 8 |
| 2011 | 9 | 7 |
| 2012 | 10 | 7 |
| 2013 | 5 | 8 |
| 2014 | 8 | 9 |
| 2015 | 8 | 5 |
| 2016 | 9 | 15 |
| 2017 | 14 | 11 |
| 2018 | 6 | 8 |
| 2019 | 13 | 14 |
| 2020 | 15 | 13 |
| 2021 | 6 | 4 |
| 2022 | 8 | 5 |
| 2023 | 1 | 7 |
| 2024 | 5 | 8 |
| 2025 | 4 | 10 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- Crossovers for vacuum packaging4 Aug 2026US 12,698,202 B2Obsidian Sensors, Inc.
- Micro-electro-mechanical system package and fabrication method thereof14 Jul 2026US 12,679,722 B2Vanguard International Semiconductor Corporation
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Wafer level package for device2 Apr 2026US 2026/0091974 A1Teknologian tutkimuskeskus VTT Oy
Most cited
By later US patents
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Vacuum package fabrication of microelectromechanical system devices with integrated circuit components166US 6,479,320 B1Raytheon Company · 2002
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Feedthrough design and method for a hermetically sealed microdevice85US 6,929,974 B2Motorola, Inc. · 2005