B81B 2207/094
Feed-through, via
B81B2207/094 (Feed-through, via) appears on 548 US grants and 671 published applications in this corpus.
Search patents in B81B- Granted patents
- 548
- Published applications
- 671
- Assignees
- 228
- Inventors
- 1,115
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 4 |
| 2003 | 2 | 2 |
| 2004 | 5 | 10 |
| 2005 | 6 | 16 |
| 2006 | 5 | 14 |
| 2007 | 6 | 17 |
| 2008 | 8 | 17 |
| 2009 | 11 | 11 |
| 2010 | 16 | 29 |
| 2011 | 17 | 28 |
| 2012 | 25 | 37 |
| 2013 | 28 | 54 |
| 2014 | 38 | 43 |
| 2015 | 48 | 48 |
| 2016 | 45 | 46 |
| 2017 | 56 | 39 |
| 2018 | 31 | 50 |
| 2019 | 38 | 32 |
| 2020 | 43 | 43 |
| 2021 | 28 | 26 |
| 2022 | 23 | 14 |
| 2023 | 16 | 20 |
| 2024 | 18 | 26 |
| 2025 | 8 | 25 |
| 2026 | 17 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Microelectromechanical element and a method for manufacturing it28 Jul 2026US 12,692,151 B2Murata Manufacturing Co., Ltd.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
Most cited
By later US patents
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Microcap wafer-level package132US 6,429,511 B2Agilent Technologies, Inc. · 2002