B81B 2207/096
Through the substrate
Official title: through the substrate
B81B2207/096 (Through the substrate) appears on 335 US grants and 407 published applications in this corpus.
Search patents in B81B- Granted patents
- 335
- Published applications
- 407
- Assignees
- 173
- Inventors
- 768
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 1 |
| 2004 | 2 | 5 |
| 2005 | 3 | 6 |
| 2006 | 4 | 8 |
| 2007 | 2 | 7 |
| 2008 | 2 | 8 |
| 2009 | 4 | 9 |
| 2010 | 12 | 20 |
| 2011 | 13 | 15 |
| 2012 | 15 | 22 |
| 2013 | 21 | 33 |
| 2014 | 23 | 28 |
| 2015 | 28 | 24 |
| 2016 | 24 | 21 |
| 2017 | 30 | 27 |
| 2018 | 20 | 35 |
| 2019 | 25 | 21 |
| 2020 | 32 | 28 |
| 2021 | 15 | 15 |
| 2022 | 14 | 8 |
| 2023 | 12 | 15 |
| 2024 | 10 | 20 |
| 2025 | 5 | 16 |
| 2026 | 11 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Wafer level proximity sensor and method of making same16 Jun 2026US 12,655,017 B2STMicroelectronics International N. V.
- Integrated device package with opening in carrier9 Jun 2026US 12,653,051 B2Skyworks Solutions, Inc.
- Package with integrated device die at least disposed within carrier2 Jun 2026US 12,648,470 B2Skyworks Solutions, Inc.
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Method of making silicon capacitive pressure sensor with glass layer between silicon wafers101US 4,773,972 AFord Motor Company · 1988
- Capacitance type accelerometer98US 5,095,752 AHitachi, Ltd. · 1992
- Feedthrough design and method for a hermetically sealed microdevice85US 6,929,974 B2Motorola, Inc. · 2005