Package with integrated device die at least disposed within carrier
AssigneeSkyworks Solutions, Inc.
InventorsTakanori Yasuda, Siarhei Dmitrievich Barsukou, Keiichi Maki, Hiroyuki Nakamura
Life of this patent
Estimating the term…
Abstract
An integrated device package is disclosed. The integrated device package can include a printed circuit board and a microelectronicmechanical systems die that is at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board. The integrated device package can include a filler material that is at least partially disposed between the microelectronicmechanical systems die and the printed circuit board. The integrated device package can include a lid that is coupled to the printed circuit board. The lid and the microelectronicmechanical systems die are spaced by a gap defining a back volume.
Claims20
An integrated device package comprising:
- a printed circuit board that is a carrier, the printed circuit board including a multilayer structure having at least a first layer and a second layer, the first layer having a first coefficient of thermal expansion, and the second layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion;
- a microelectronicmechanical systems die at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board;
- a filler material at t least partially disposed between the microelectronicmechanical systems die and the printed circuit board;
- and
- a lid coupled to the printed circuit board, the lid and the printed circuit board at least partially defining a cavity, the lid and the microelectronicmechanical systems die spaced by a gap defining a back volume.
An integrated device package comprising:
- a microelectronicmechanical systems die;
- a printed circuit board that is a carrier, the microelectronicmechanical systems die at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board, the printed circuit board including a multilayer structure having at least a first layer and a second layer, the first layer has a first coefficient of thermal expansion and the second layer has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion, the second coefficient of thermal expansion is closer to a coefficient of thermal expansion of the microelectronicmechanical systems die than to the first coefficient of thermal expansion;
- a filler material at least partially disposed between the microelectronicmechanical systems die and the printed circuit board;
- and
- a lid coupled to the printed circuit board, the lid and the printed circuit board at least partially defining a cavity, the lid and the microelectronicmechanical systems die spaced by a gap defining a back volume.
An integrated device package comprising:
- a microelectronicmechanical systems die;
- a printed circuit board that is a carrier, the printed circuit board includes a multilayer structure having a first layer and a second layer, the first layer has a first coefficient of thermal expansion and the second layer has a second coefficient of thermal expansion greater than the first coefficient of thermal expansion, the second coefficient of thermal expansion is closer to a coefficient of thermal expansion of the microelectronicmechanical systems die than to the first coefficient of thermal expansion, an electrical resistance of the second layer is greater than an electrical resistance of the first layer, the microelectronicmechanical systems die at least partially disposed within the printed circuit board, the microelectronicmechanical systems die electrically connected to the printed circuit board by way of a conductive trace at least partially formed on the printed circuit board;
- and
- a lid coupled to the printed circuit board, the lid and the printed circuit board at least partially defining a cavity, the lid and the microelectronicmechanical systems die spaced by a gap defining a back volume.
A wireless communication device comprising:
- a microphone including a printed circuit board including a multilayer structure having at least a first layer and a second layer, the first layer having a first coefficient of thermal expansion, and the second layer having a second coefficient of thermal expansion greater than the first coefficient of thermal expansion, a piezoelectric microelectronicmechanical systems microphone die at least partially disposed within the printed circuit board and electrically coupled to the printed circuit board, and a lid coupled to the printed circuit board, the lid and the microelectronicmechanical systems die spaced by a gap defining a back volume;
- and
- a radio frequency front end in communication with the microphone.
Dependencies are inferred from the claim text.