B81B 2207/095
Through the lid
Official title: through the lid
B81B2207/095 (Through the lid) appears on 227 US grants and 278 published applications in this corpus.
Search patents in B81B- Granted patents
- 227
- Published applications
- 278
- Assignees
- 116
- Inventors
- 488
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 4 |
| 2003 | 1 | 2 |
| 2004 | 5 | 8 |
| 2005 | 4 | 13 |
| 2006 | 3 | 5 |
| 2007 | 4 | 9 |
| 2008 | 6 | 9 |
| 2009 | 7 | 3 |
| 2010 | 7 | 12 |
| 2011 | 5 | 17 |
| 2012 | 12 | 20 |
| 2013 | 12 | 26 |
| 2014 | 17 | 13 |
| 2015 | 18 | 25 |
| 2016 | 20 | 16 |
| 2017 | 24 | 14 |
| 2018 | 10 | 16 |
| 2019 | 15 | 13 |
| 2020 | 13 | 18 |
| 2021 | 14 | 12 |
| 2022 | 8 | 3 |
| 2023 | 3 | 2 |
| 2024 | 7 | 8 |
| 2025 | 2 | 6 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- 3D mems device with hermetic cavity24 Feb 2026US RE50,807 E1Motion Engine Inc.
- Laterally-doped MEMS resonator with piezoelectric layer17 Feb 2026US 12,556,157 B1SiTime Corporation
- Sensor4 Nov 2025US 12,459,808 B2Kabushiki Kaisha Toshiba
- Microelectromechanical device and a method20 Aug 2026US 2026/0242204 A1Murata Manufacturing Co., Ltd.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Methods and systems for stacked microelectromechanical system devices19 Feb 2026US 2026/0048983 A1Miramems Sensing Technology Co., Ltd
- Sensor29 Jan 2026US 2026/0028221 A1Toshiba Corp. (K. K. Toshiba)
- Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature25 Dec 2025US 2025/0388459 A1Stathera IP Holdings Inc.
Most cited
By later US patents
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Microcap wafer-level package132US 6,429,511 B2Agilent Technologies, Inc. · 2002
- Method of fabricating microelectromechanical systems and devices having trench isolated contacts114US 6,936,491 B2Robert Bosch GmbH · 2005
- Capacitance type accelerometer98US 5,095,752 AHitachi, Ltd. · 1992