H10W 80/743
Having disposition changed during the connecting
Official title: {having disposition changed during the connecting}
H10W80/743 (Having disposition changed during the connecting) appears on 868 US grants and 1,211 published applications in this corpus.
Search patents in H10W- Granted patents
- 868
- Published applications
- 1,211
- Assignees
- 176
- Inventors
- 1,553
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 0 | 0 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 3 |
| 2010 | 0 | 4 |
| 2011 | 1 | 6 |
| 2012 | 4 | 6 |
| 2013 | 4 | 17 |
| 2014 | 20 | 16 |
| 2015 | 27 | 61 |
| 2016 | 39 | 32 |
| 2017 | 38 | 40 |
| 2018 | 27 | 35 |
| 2019 | 31 | 46 |
| 2020 | 61 | 119 |
| 2021 | 81 | 148 |
| 2022 | 103 | 185 |
| 2023 | 159 | 128 |
| 2024 | 110 | 150 |
| 2025 | 113 | 116 |
| 2026 | 44 | 91 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Memory device and method of assembling same22 Sep 2026US 12,745,632 B2SanDisk Technologies LLC
- Semiconductor device comprising bonded a plurality of semiconductor structures along with conductive layers and bonding pads15 Sep 2026US 12,740,396 B2SK hynix Inc.
- Anti-warpage reinforced carrier15 Sep 2026US 12,740,419 B2Kinsus Interconnect Technology Corp.
- Semiconductor device and method for forming the same8 Sep 2026US 12,733,180 B2Macronix International Co., Ltd.
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Semiconductor package and method of manufacturing the semiconductor package1 Oct 2026US 2026/0305403 A1Samsung Electronics Co., Ltd.
- Method of manufacturing 3dic package comprising a plurality of discrete device dies bonding to a wafer1 Oct 2026US 2026/0305486 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and method of manufacturing the semiconductor package24 Sep 2026US 2026/0293733 A1Samsung Electronics Co., Ltd.
- Semiconductor structure and manufacturing method thereof17 Sep 2026US 2026/0283041 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods for hybrid wafer bonding271US 8,802,538 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with air-gap structure246US 9,312,229 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Hybrid bonding with air-gap structure242US 9,960,142 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018