H10W 80/301
Bonding techniques
Official title: {Bonding techniques, e.g. hybrid bonding}
H10W80/301 (Bonding techniques) appears on 3,604 US grants and 5,824 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,604
- Published applications
- 5,824
- Assignees
- 495
- Inventors
- 5,467
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 3 |
| 2002 | 3 | 8 |
| 2003 | 5 | 9 |
| 2004 | 7 | 13 |
| 2005 | 10 | 17 |
| 2006 | 12 | 27 |
| 2007 | 14 | 25 |
| 2008 | 12 | 29 |
| 2009 | 14 | 23 |
| 2010 | 17 | 42 |
| 2011 | 34 | 47 |
| 2012 | 28 | 56 |
| 2013 | 55 | 71 |
| 2014 | 70 | 81 |
| 2015 | 84 | 130 |
| 2016 | 107 | 110 |
| 2017 | 132 | 124 |
| 2018 | 135 | 174 |
| 2019 | 151 | 236 |
| 2020 | 258 | 422 |
| 2021 | 332 | 569 |
| 2022 | 395 | 602 |
| 2023 | 447 | 663 |
| 2024 | 427 | 764 |
| 2025 | 497 | 826 |
| 2026 | 345 | 753 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 80/312Characterised by the direct bonding of electrically conductive pads2,635
- H10W 80/327Characterised by the direct bonding of insulating parts2,608
- H10W 80/331Characterised by the application of energy for connecting621
- H10W 80/314Characterized by direct bonding of pads or other interconnections267
- H10W 80/341Anodic bonding16
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Most cited
By later US patents
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