H10W 80/341
Anodic bonding
Official title: {Anodic bonding}
H10W80/341 (Anodic bonding) appears on 16 US grants and 21 published applications in this corpus.
Search patents in H10W- Granted patents
- 16
- Published applications
- 21
- Assignees
- 16
- Inventors
- 46
- Latest grant
- 21 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 2 | 3 |
| 2017 | 3 | 2 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 2 | 4 |
| 2021 | 2 | 1 |
| 2022 | 1 | 1 |
| 2023 | 2 | 2 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit including backside conductive vias21 Jan 2025US 12,205,997 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method and device for transferring components1 Oct 2024US 12,103,787 B2EV Group E. Thallner GmbH
- Stress compensation for wafer to wafer bonding8 Aug 2023US 11,721,554 B2Intel Corporation
- Wafer bonding in fabrication of 3-dimensional NOR memory circuits25 Jul 2023US 11,710,729 B2Sunrise Memory Corporation
- Inertial sensor, electronic instrument, vehicle, and method for manufacturing inertial sensor22 Mar 2022US 11,282,808 B2Seiko Epson Corporation
- Method of manufacturing semiconductor device including bonding of substrate structures11 Jun 2026US 2026/0165219 A1SK hynix Inc.
- Method and device for transferring components19 Dec 2024US 2024/0417189 A1EV Group E. Thallner GmbH
- Integrated circuit including backside conductive vias21 Nov 2024US 2024/0387652 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method and device for transferring components2 Mar 2023US 2023/0062106 A1EV Group E. Thallner GmbH
- Bonding method, bonded article, and bonding device2 Feb 2023US 2023/0030272 A1Bondtech Co., Ltd.
Most cited
By later US patents
- Semiconductor device and method for manufacturing same9US 10,541,230 B2Panasonic Intellectual Property Management Co., Ltd. · 2020
- Method for bonding substrates together, and substrate bonding device6US 10,580,752 B2Bondtech Co., Ltd. · 2020
- MEMS pressure sensor device and manufacturing method thereof2US 8,590,389 B2Metrodyne Microsystems Corporation, R.O.C. · 2013
- Bonded nanofluidic device chip stacks1US 11,094,683 B2International Business Machines Corporation · 2021
- Wafer bonding in fabrication of 3-dimensional NOR memory circuits1US 11,158,620 B2Sunrise Memory Corporation · 2021