Method of manufacturing semiconductor device including bonding of substrate structures
AssigneeSK hynix Inc.
InventorHwan Young KIM
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Abstract
In a method of manufacturing a semiconductor device according to an embodiment of the present disclosure, a first substrate structure including a first connection pad and a second substrate structure including a second connection pad are prepared. A surface of at least one of the first and second connection pads is charged with a negative charge. The first and second substrate structures are heat-treated while the first and second connection pads are in contact with each other for bonding the first and second substrate structures to each other.
Claims20
A method of manufacturing a semiconductor device, the method comprising:
- preparing a first substrate structure including a first connection pad and a second substrate structure including a second connection pad;
- charging a surface of at least one of the first and second connection pads with a negative charge;
- and
- heat-treating the first and second substrate structures while the first and second connection pads are in contact with each other to bond the first and second substrate structures to each other.
A method of manufacturing a semiconductor device, the method comprising:
- preparing a first substrate structure including a first connection pad and a second substrate structure including a second connection pad;
- charging a surface of at least one of the first and second connection pads with a positive charge;
- and
- heat-treating the first and second substrate structures while the first and second connection pads are in contact with each other to bond the first and second substrate structures to each other.
Dependencies are inferred from the claim text.