Inertial sensor, electronic instrument, vehicle, and method for manufacturing inertial sensor

An inertial sensor comprising:

• a support substrate;
• a sensor main body supported by the support substrate;
• and
• a bonding member that is located between the support substrate and the sensor main body and bonds the sensor main body to the support substrate,
• wherein the sensor main body includes:
• a sensor substrate bonded to the support substrate via the bonding member;
• and
• a capacitance-type sensor device provided at a side of the sensor substrate opposite to the support substrate,
• the sensor substrate has a side surface, a first principal surface facing a main surface of the support substrate, and a recessed step section that is located between the side surface and the first principal surface and connects the side surface to the first principal surface,
• the bonding member extends along the first principal surface and the recessed step section,
• the side surface of the sensor substrate extends on a first plane, and a cavity is formed by an inner surface of the recessed step section, the main surface of the support substrate, and the first plane, and
• the cavity is filled with a vacant space and the bonding member.