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US 12,103,787 B2Granted
Method and device for transferring components
AssigneeEV Group E. Thallner GmbH
InventorJurgen Burggraf
Life of this patent
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Abstract
A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate. The components can be transferred selectively by means of bonding means and/or debonding means.
Claims13
A method for the transfer of components from a sender substrate to a receiver substrate with at least the following steps:
- i) provision and/or production of the components on the sender substrate,
- ii) transfer of the components of the sender substrate to the transfer substrate,
- iii) transfer of the components from the transfer substrate to the receiver substrate,
- wherein the components can be transferred selectively by means of bonding means and/or debonding means,
- wherein individual components or a plurality of components are fixed, locally limited, during the transfer in step ii) and step iii) by the bonding means by laser radiation and released, locally limited, during the transfer in step ii) and step iii) by the debonding means by laser radiation.
2 more elements
Dependencies are inferred from the claim text.