MEMS pressure sensor device and manufacturing method thereof
AssigneeMetrodyne Microsystems Corporation, R.O.C.
InventorsChin-Fu Hsu, Chia-Hsing Shih
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Abstract
The present invention discloses a Micro-Electro-Mechanical System (MEMS) pressure sensor device and a manufacturing method thereof. The MEMS pressure sensor device includes: a substrate having at least one recess formed on an upper surface thereof, the recess defining a boss; a membrane, which is bonded to at least a part of the upper surface and at least a part of the boss, so that the at least one recess forms a cavity; at least one sensing unit, which is coupled to the membrane, for sensing deflection of the membrane; and an opening, which is formed on a lower surface of the substrate, and connects to the cavity.
Claims14
A micro-electro-mechanical system (MEMS) pressure sensor device, comprising:
- a substrate having at least one recess formed on an upper surface thereof, the recess defining a boss;
- a membrane, which is bonded to at least a part of the upper surface of the substrate and at least a part of the boss, so that the at least one recess forms a cavity;
- at least one sensing unit, which is coupled to the membrane for sensing deflection of the membrane;
- and
- a first opening, which is formed on a lower surface of the substrate, and connects to the cavity.
A manufacturing method of Micro-Electro-Mechanical System (MEMS) pressure sensor device, comprising:
- forming at least one recess on an upper surface of a substrate, the at least one recess defining a boss;
- bonding a membrane to at least a part of the upper surface of the substrate and at least a part of the boss, so that the at least one recess forms a cavity;
- coupling at least one sensing unit to the membrane for sensing deflection of the membrane;
- and
- forming a first opening on a lower surface of the substrate by an etching process or a polishing process, and connecting the first opening to the cavity.
Dependencies are inferred from the claim text.