Semiconductor device with through electrode through mold structure
AssigneeSamsung Electronics Co., Ltd.
InventorsMyunghun LEE, Hyuckjoon Kwon, Junhyoung Kim, Youngseok Byeon
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AssigneeSamsung Electronics Co., Ltd.
InventorsMyunghun LEE, Hyuckjoon Kwon, Junhyoung Kim, Youngseok Byeon
Estimating the term…
A semiconductor device including: a cell structure including: a first surface; a second surface opposite to the first surface; and a main block and a dummy block each comprising a cell region and a connection region, in which the dummy block includes: a mold structure comprising at least one gate electrode and at least one mold insulating layer in a first direction in the cell region and the connection region; a common source layer on the mold structure; a first insulating layer on the mold structure and the common source layer; a channel structure connected to the common source layer; a cell plug in contact with the at least one gate electrode; a contact structure passing through the first insulating layer; and a through electrode connected to the contact structure by passing through the mold structure in the first direction in the cell region.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.