H10W 80/312
Characterised by the direct bonding of electrically conductive pads
Official title: {characterised by the direct bonding of electrically conductive pads}
H10W80/312 (Characterised by the direct bonding of electrically conductive pads) appears on 2,635 US grants and 4,510 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,635
- Published applications
- 4,510
- Assignees
- 302
- Inventors
- 4,200
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 3 |
| 2003 | 1 | 2 |
| 2004 | 1 | 2 |
| 2005 | 1 | 3 |
| 2006 | 1 | 2 |
| 2007 | 3 | 6 |
| 2008 | 1 | 11 |
| 2009 | 5 | 3 |
| 2010 | 6 | 17 |
| 2011 | 10 | 12 |
| 2012 | 9 | 25 |
| 2013 | 21 | 33 |
| 2014 | 33 | 38 |
| 2015 | 38 | 60 |
| 2016 | 51 | 67 |
| 2017 | 70 | 63 |
| 2018 | 79 | 102 |
| 2019 | 99 | 159 |
| 2020 | 166 | 324 |
| 2021 | 261 | 473 |
| 2022 | 322 | 514 |
| 2023 | 373 | 557 |
| 2024 | 358 | 652 |
| 2025 | 419 | 701 |
| 2026 | 301 | 681 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
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- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Interconnect structure for stacked semiconductor device573US 6,465,892 B1Fujitsu Limited · 2002