H10W 72/325
Die-attach connectors having a filler embedded in a matrix
Official title: {Die-attach connectors having a filler embedded in a matrix}
H10W72/325 (Die-attach connectors having a filler embedded in a matrix) appears on 4,487 US grants and 5,192 published applications in this corpus.
Search patents in H10W- Granted patents
- 4,487
- Published applications
- 5,192
- Assignees
- 1,012
- Inventors
- 8,240
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 8 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 14 | 0 |
| 1992 | 18 | 0 |
| 1993 | 7 | 0 |
| 1994 | 20 | 0 |
| 1995 | 15 | 0 |
| 1996 | 28 | 0 |
| 1997 | 28 | 0 |
| 1998 | 47 | 0 |
| 1999 | 44 | 0 |
| 2000 | 68 | 0 |
| 2001 | 71 | 26 |
| 2002 | 70 | 84 |
| 2003 | 67 | 84 |
| 2004 | 64 | 100 |
| 2005 | 67 | 115 |
| 2006 | 71 | 112 |
| 2007 | 70 | 142 |
| 2008 | 62 | 133 |
| 2009 | 88 | 162 |
| 2010 | 113 | 182 |
| 2011 | 119 | 208 |
| 2012 | 163 | 218 |
| 2013 | 172 | 234 |
| 2014 | 191 | 255 |
| 2015 | 216 | 270 |
| 2016 | 221 | 277 |
| 2017 | 262 | 305 |
| 2018 | 222 | 283 |
| 2019 | 277 | 301 |
| 2020 | 289 | 399 |
| 2021 | 248 | 359 |
| 2022 | 281 | 331 |
| 2023 | 240 | 184 |
| 2024 | 257 | 175 |
| 2025 | 158 | 165 |
| 2026 | 80 | 88 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same29 Sep 2026US 12,751,310 B2Furukawa Electric Co., Ltd.
- Power module, power supply circuit, and chip15 Sep 2026US 12,740,408 B2Huawei Technologies Co., Ltd.
- Laser transfer of microelectronic device and associated conductive pad15 Sep 2026US 12,740,464 B2Coherent LaserSystems GmbH & Co. KG
- Semiconductor element bonding portion and semiconductor device8 Sep 2026US 12,733,494 B2Fuji Electric Co., Ltd.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Semiconductor package structure, heat dissipation material, and manufacturing method thereof1 Oct 2026US 2026/0305341 A1Metal Industries Research & Development Centre
- Semiconductor device and semiconductor memory device24 Sep 2026US 2026/0293761 A1
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof346US 6,448,661 B1Samsung Electornics Co., Ltd. · 2002
- Method of making a cavity ball grid array apparatus317US 6,326,244 B1Micron Technology, Inc. · 2001
- Wafer bonding method299US 7,470,142 B22008
- Semiconductor device and method of manufacturing thereof293US 4,707,724 AHitachi, Ltd. · 1987