Power module, power supply circuit, and chip
AssigneeHuawei Technologies Co., Ltd.
InventorsFengqun Lang, Yutao Wang, Huibin Chen
Life of this patent
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Abstract
A power module includes a first metal layer-clad substrate and a second metal layer-clad substrate that are disposed opposite to each other, and a chip and an interconnection pillar that are located between the first metal layer-clad substrate and the second metal layer-clad substrate. The chip and the first metal layer-clad substrate are electrically connected through press sintering by using a sintering material to improve bonding reliability. The chip is electrically connected to the second metal layer-clad substrate by using the interconnection pillar.
Claims20
A power module for use in a power supply, comprising:
- a first metal layer-clad substrate and a second metal layer-clad substrate disposed opposite to each other;
- a chip;
- and
- an interconnection pillar,
- wherein the chip and the interconnection pillar are located between the first metal layer-clad substrate and the second metal layer-clad substrate, a sintering material is disposed between the chip and the first metal layer-clad substrate, the chip and the first metal layer-clad substrate are electrically connected by using the sintering material, and the sintering material comprises silver paste, copper paste, or a silver film, and the interconnection pillar is located between the chip and the second metal layer-clad substrate, and the chip is connected to the second metal layer-clad substrate by using the interconnection pillar.
Dependencies are inferred from the claim text.