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US 7,470,142 B2Granted
Wafer bonding method
OwnerSang-Yun Leeinventor
Life of this patent
Estimating the term…
Abstract
A method of coupling substrates together includes steps of providing first and second substrates. The second substrate includes a conductive bonding region positioned on its surface. Heat is provided to the conductive bonding region to reduce its number of defects. The surface of the conductive bonding region is bonded to the first substrate so that the conductive bonding region and the first substrate are coupled together.
Claims42
A method of coupling substrates together comprising:
- providing a first substrate;
- providing a second substrate which carries a conductive bonding region;
- providing a first amount of heat for a predetermined amount of time to the conductive bonding region to reduce its number of defects;
- bonding a surface of the conductive bonding region to the first substrate so that the conductive bonding region and the first substrate are coupled together;
- and
- processing the second substrate to form a vertically oriented semiconductor device.
3 more elements
A method of coupling substrates together comprising:
- providing a first substrate which carries electrical circuitry;
- providing a conductive line connected to the electrical circuitry and extending through an interlayer dielectric region carried by the first substrate;
- providing a second substrate which carries a conductive bonding region;
- providing a first amount of heat for a predetermined amount of time to the conductive bonding region;
- and
- bonding the conductive bonding region to the interlayer dielectric region so the conductive bonding region is connected to the electrical circuitry through the conductive line.
3 more elements
A method of coupling substrates together comprising:
- providing a first substrate which carries electrical circuitry;
- providing an interlayer dielectric region carried by the first substrate;
- providing a conductive line connected to the electrical circuitry and extending through the interlayer dielectric region;
- providing a second substrate which carries a conductive bonding region;
- providing a first amount of heat for a first amount of time to the conductive bonding region;
- providing a second amount of heat for a second amount of time to the conductive bonding region and bonding the conductive bonding region to the interlayer dielectric region;
- and
- removing a portion of the second substrate.
5 more elements
A method of coupling substrates together comprising:
- providing a first substrate which carries electrical circuitry;
- providing a conductive line and interlayer dielectric region carried by the first substrate, the conductive line being connected to the electrical circuitry and extending through the interlayer dielectric region;
- providing a second substrate;
- coupling the first and second substrates together by using a conductive bonding region;
- and
- processing the second substrate to form a vertically oriented semiconductor device.
3 more elements
Dependencies are inferred from the claim text.