H10W 72/07355
Changes in materials
Official title: {changes in materials}
H10W72/07355 (Changes in materials) appears on 569 US grants and 721 published applications in this corpus.
Search patents in H10W- Granted patents
- 569
- Published applications
- 721
- Assignees
- 244
- Inventors
- 1,361
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 6 |
| 2003 | 1 | 5 |
| 2004 | 5 | 4 |
| 2005 | 4 | 12 |
| 2006 | 4 | 11 |
| 2007 | 7 | 15 |
| 2008 | 6 | 17 |
| 2009 | 10 | 18 |
| 2010 | 12 | 10 |
| 2011 | 12 | 31 |
| 2012 | 11 | 19 |
| 2013 | 29 | 32 |
| 2014 | 33 | 43 |
| 2015 | 39 | 51 |
| 2016 | 34 | 47 |
| 2017 | 41 | 42 |
| 2018 | 43 | 45 |
| 2019 | 39 | 36 |
| 2020 | 29 | 62 |
| 2021 | 43 | 56 |
| 2022 | 29 | 35 |
| 2023 | 45 | 34 |
| 2024 | 28 | 36 |
| 2025 | 29 | 36 |
| 2026 | 21 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Power semiconductor module and manufacturing method8 Sep 2026US 12,733,543 B2Hitachi Energy Switzerland AG
- Printed circuit board and semiconductor package including the same11 Aug 2026US 12,707,569 B2Samsung Electronics Co., Ltd.
- Heat dissipation in semiconductor devices28 Jul 2026US 12,696,763 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor module28 Jul 2026US 12,696,809 B2Fuji Electric Co., Ltd.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Delamination/cracking improvement at solder joints in microelectronics package1 Oct 2026US 2026/0305441 A1Qorvo US, Inc.
- Semiconductor devices and methods of manufacturing semiconductor devices13 Aug 2026US 2026/0240033 A1Amkor Technology Singapore Holding Pte.Ltd.
- Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structures6 Aug 2026US 2026/0231787 A1Infineon Technologies AG
- Microelectronic structures including bridges30 Jul 2026US 2026/0223725 A1Intel Corporation
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials229US 6,335,263 B12002
- Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding214US 8,546,956 B2International Business Machines Corporation · 2013
- Nickel tin bonding system with barrier layer for semiconductor wafers and devices198US 7,910,945 B2Cree, Inc. · 2011