Method for manufacturing semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorTatsuo Nishizawa
Life of this patent
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Abstract
A method for manufacturing a semiconductor module can prevent performance and reliability degradation of a semiconductor module. The method for manufacturing a semiconductor module includes: arranging an insulating wiring board on a low die; arranging a sintering material at plural locations on the insulating wiring board and arranging a semiconductor chip on each of the plural sintering materials; arranging a structure above protruding portions of the sintering materials protruding from a periphery of each of the plural semiconductor chips; and sintering by pressurizing and heating the plural sintering materials by an upper die through the structure at the protruding portions and through the semiconductor chips at contacting portions in contact with lower surfaces of the semiconductor chips.
Claims21
A method for manufacturing a semiconductor module comprising:
- arranging an insulating wiring board on a lower die;
- arranging a sintering material at a plurality of locations on the insulating wiring board and arranging a semiconductor chip on each of the plurality of sintering materials;
- arranging a structure above protruding portions of the sintering materials protruding from a periphery of each of the plurality of semiconductor chips;
- and
- sintering by pressurizing and heating the plurality of sintering materials by means of an upper die through the structure at the protruding portions of the sintering materials and through the semiconductor chips at portions of the sintering materials under the semiconductor chips.
Dependencies are inferred from the claim text.