H10W 70/618
The bridge chips being embedded in the package substrates, interposers or redistribution
Official title: {the bridge chips being embedded in the package substrates, interposers or redistribution layers}
H10W70/618 (The bridge chips being embedded in the package substrates, interposers or redistribution) appears on 716 US grants and 1,052 published applications in this corpus.
Search patents in H10W- Granted patents
- 716
- Published applications
- 1,052
- Assignees
- 96
- Inventors
- 1,227
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 2 | 2 |
| 2013 | 1 | 0 |
| 2014 | 4 | 11 |
| 2015 | 10 | 23 |
| 2016 | 19 | 35 |
| 2017 | 28 | 26 |
| 2018 | 27 | 43 |
| 2019 | 43 | 73 |
| 2020 | 47 | 101 |
| 2021 | 63 | 132 |
| 2022 | 87 | 122 |
| 2023 | 113 | 164 |
| 2024 | 110 | 136 |
| 2025 | 115 | 104 |
| 2026 | 41 | 71 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure and method for manufacturing the same25 Aug 2026US 12,721,137 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Via micro-modules for through mold via replacement25 Aug 2026US 12,721,192 B2Intel Corporation
- Three-dimensional integration of dies in an integrated circuit device18 Aug 2026US 12,713,950 B2Intel Corporation
- Semiconductor device11 Aug 2026US 12,707,966 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device4 Aug 2026US 12,702,027 B2Advanced Semiconductor Engineering, Inc.
- Semiconductor package with alignment marks1 Oct 2026US 2026/0305371 A1Samsung Electronics Co., Ltd.
- Circuit board and semiconductor package substrate comprising same1 Oct 2026US 2026/0305401 A1LG Innotek Co., Ltd.
- Semiconductor package and method of manufacturing the same17 Sep 2026US 2026/0282955 A1Samsung Electronics Co., Ltd.
- Chip package with silicon bridge17 Sep 2026US 2026/0282956 A1Advanced Micro Devices, Inc.
- Package structure and method for forming the same17 Sep 2026US 2026/0282959 A1JCET Microelectronics (Jiangyin) Co., LTD.
Most cited
By later US patents
- Semiconductor device and method of manufacturing semiconductor device273US 7,402,901 B2Sony Corporation · 2008
- Multi-chip package and method of providing die-to-die interconnects in same161US 8,227,904 B2Intel Corporation · 2012
- Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same156US 8,064,224 B2Intel Corporation · 2011
- Direct external interconnect for embedded interconnect bridge package108US 8,901,748 B2Intel Corporation · 2014
- Method for making high density substrate interconnect using inkjet printing102US 9,349,703 B2Intel Corporation · 2016