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US 2026/0305401 A1Published application
Circuit board and semiconductor package substrate comprising same
AssigneeLG Innotek Co., Ltd.
InventorsYong Ho SON, Yong Suk KIM, Moo Seong KIM
Life of this patent
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Abstract
A circuit board according to an embodiment includes a first insulating layer having a cavity; a connection member disposed in the cavity of the first insulating layer; and a second insulating layer disposed on the first insulating layer and embedding the connection member, wherein a lower surface of the connection member has a step, and the second insulating layer is in contact with at least a portion of the step of the connection member.
Claims20
A circuit board comprising:
- a first insulating layer having a cavity;
- a connection member disposed in the cavity of the first insulating layer, and
- a second insulating layer disposed on the first insulating layer and embedding the connection member,
- wherein a lower surface of the connection member has a step, and
- wherein the second insulating layer is in contact with at least a portion of the step of the connection member.
2 more elements
A circuit board comprising:
- a build-up insulating layer;
- a connection member embedded in the build-up insulating layer;
- and
- an electrode part penetrating at least a portion of the build-up insulating layer and overlapping the connecting member in a vertical direction,
- wherein the connection member includes an insulating part;
- a plurality of upper pads disposed on an upper surface of the insulating part;
- and a metal layer disposed on a lower surface of the insulating part,
- wherein the electrode part includes a plurality of first via electrodes disposed under the connection member and spaced apart from each other in a horizontal direction, and a plurality of second via electrodes disposed on the connection member and connected to the plurality of upper pads, and
- wherein the plurality of first via electrodes are electrically connected to each other through the metal layer.
6 more elements
Dependencies are inferred from the claim text.