Three-dimensional integration of dies in an integrated circuit device
AssigneeIntel Corporation
InventorsJeremy D. Ecton, Brandon Christian Marin, Srinivas V. Pietambaram, Gang Duan, Suddhasattwa Nad
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Abstract
In one embodiment, an integrated circuit device includes a first layer having input/output (IO) hub circuitry to interconnect a plurality of integrated circuit dies, and a second layer having a plurality of integrated circuit dies electrically connected to the IO hub circuitry. The first layer may include glass, and the IO hub circuitry may be in a die embedded within the first layer. The integrated circuit dies may be electrically connected to the IO hub circuitry through an interposer.
Claims20
An integrated circuit device comprising:
- a package substrate;
- and
- an integrated circuit device coupled to the package substrate, the integrated circuit device comprising:
- a first layer comprising glass and an input/output (IO) hub circuitry die embedded in a cavity of the glass, the IO hub circuitry die to interconnect a plurality of integrated circuit dies, the IO hub circuitry die electrically connected to the package substrate;
- and
- a second layer on the first layer, the second layer comprising a plurality of integrated circuit dies, wherein at least two of the integrated circuit dies are electrically connected to the IO hub circuitry die through an interposer in the second layer, the interposer comprising circuitry to interconnect the at least two integrated circuit dies.
A system comprising:
- a main circuit board;
- and
- an integrated circuit package coupled to the main circuit board, the integrated circuit package comprising:
- a package substrate;
- and
- an integrated circuit device connected to the package substrate, the integrated circuit device comprising:
- a first integrated circuit die embedded in a first layer comprising glass, the first integrated circuit die electrically connected to the package substrate;
- and
- a plurality of second integrated circuit dies in a second layer, the second integrated circuit dies electrically connected to the first integrated circuit die, wherein at least two second integrated circuit dies are connected to the first integrated circuit die through an interposer, the interposer comprising circuitry to interconnect the at least two second integrated circuit dies.
A method of manufacturing an integrated circuit package, comprising:
- forming an integrated circuit chip, comprising:
- embedding a first integrated circuit die within a cavity of a glass layer;
- attaching an assembly comprising a plurality of second integrated circuit dies and an interposer to a top side of the glass layer, wherein attaching the assembly directly couples the interposer to the first integrated circuit die;
- and
- depositing a mold material around the assembly;
- and
- coupling the integrated circuit chip to a package substrate.
Dependencies are inferred from the claim text.