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AssigneeAdvanced Micro Devices, Inc.
InventorsDeepak Vasant KULKARNI, Alan D. SMITH, Raja SWAMINATHAN, Manish DUBEY, Kaushik MYSORE
Estimating the term…
Disclosed herein are chip packages and electronic devices that utilized a silicon bridge having a memory controller to interface between a logic device having at least one compute die and one or more memory stacks within a singular chip package. In one example, a chip package is provided that a substrate, a plurality of silicon bridges, a redistribution layer, a logic device, and a memory stack. The plurality of silicon bridges are disposed in a common layer and electrically and mechanically coupled to the substrate. At least a first silicon bridge of the plurality of silicon bridges includes a plurality of decoupling capacitors. The redistribution layer is disposed on the plurality of silicon bridges. The logic device is disposed over the redistribution layer and includes one or more compute dies. The memory stack is disposed over the redistribution layer adjacent the logic device.
A chip package comprising:
A chip package comprising:
A chip package comprising:
Dependencies are inferred from the claim text.